E3WSDC12-32.768K TR

E3WS Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Watch Crystal Resonator 1.2mm x 2.0mm x 0.6mm 2 Pad Plastic Surface Mount (SMD) 32.768kHz ELECTRICAL SPECIFICATIONS Nominal Frequency 32.768kHz Frequency Tolerance (at 25°C) ±20ppm (See Options) Load Capacitance 12.5pF (See Options) Operating Temperature Range -40°C to +85°C (See Options) Storage Temperature Range -55°C to +125°C Turnover Temperature +25°C±5°C Mode of Operation Flexural Mode (Tuning Fork) Frequency Stability -0.03ppm/(Change in °C)2 Typical, -0.04ppm/(Change in °C)2 Maximum, Parabolic Curve 90,000 Ohms Maximum (-40°C to +85°C Option) Equivalent Series Resistance 110,000 Ohms Maximum (-40°C to +125°C Option) Drive Level 0.5µWatt Maximum Aging (at 25°C) ±2ppm/First Year Maximum Quality Factor Shunt Capacitance (Co) 9000 Minimum 0.9 pF ~ 1.2pF Typical Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc ±15Vdc) Revised C: 04/12/21 Page 1 of 6 www.ecliptek.com E3WS Series PART NUMBERING GUIDE Revised C: 04/12/21 Page 2 of 6 www.ecliptek.com E3WS Series MECHANICAL DIMENSIONS Note: Due to material availability, the outline and finish color of the component may vary. This variation in no way affects the electrical performance of the product. SUGGESTED SOLDER PAD LAYOUT PIN CONNECTION 1 Crystal 2 Crystal All Tolerances are ±0.1 All Dimensions in Millimeters Revised C: 04/12/21 Page 3 of 6 www.ecliptek.com E3WS Series TAPE & REEL DIMENSIONS Quantity per Reel: 3000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised C: 04/12/21 Page 4 of 6 www.ecliptek.com E3WS Series RECOMMENDED SOLDER REFLOW METHODS LOW TEMPERATURE INFRARED/CONVECTION 240°C TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) N/A 150°C N/A 60 - 120 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 5°C/Second Maximum Peak Temperature (TP) 245°C Maximum Target Peak Temperature (TP Target) 245°C Maximum 2 Times / 230˚C Maximum 1 Time Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 150°C 200 Seconds Maximum Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised C: 04/12/21 Page 5 of 6 www.ecliptek.com E3WS Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION 245°C TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) N/A 150°C N/A 30 - 60 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 5°C/Second Maximum Peak Temperature (TP) 245°C Maximum Target Peak Temperature (TP Target) 245°C Maximum 2 Times / 230˚C Maximum 1 Time Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 150°C 200 Seconds Maximum Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised C: 04/12/21 Page 6 of 6 www.ecliptek.com